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Kriya, acknowledging a need for forming low electrical resistance junctions, a heat-stable junction is formed of indium (In), tin (Sn), and nickel (Ni). The is made by heating a layer of indium and tin aligned against a layer of nickel at around temperature of 400° C forming a stable intermetallic bond between the semiconductor.

There are several commercial methods used for joining electrical components for stable operation at high-temperature. In the soldering approach, a mixture of metals is applied between the two parts that needs to be joined. But this approach does not come without drawbacks. The metals are chemically aggressive and the composition of the components of electrical elements can be degraded by chemical interaction. Also, the aluminum-silicon braze is only stable to about 660° C., thereby limiting the useful temperature range.

Thank you for the answers. Can this be used to operate at thermo-compression bonding as well?

Oh yes! It can be used. Normally Thermo-compression bonding makes use of thin gold layers between the two components. The layers are heated to a high temperature to create unified gold layer. Gold does not oxidize at standard pressure, temperature, and in common environments, hence thermo-compression bonding can result in a low resistance electrical contact. Sincegold is known to quickly diffuse, the deep diffusion of gold is known to poison thermoelectric materials and degrade the performance of thermoelectric device. Here the thermal expansion coefficient of a nickel shoe is very closely matched across the spanned temperature range, thereby resulting in reduced thermal stress and resistance to breakage